attrezzature per l'assemblaggio elettronico - SMT

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M - Series pick & places

Flexibilty and accuracy for complex components mixes

The M-Series is a flexible solution for manufacturing medium and large batches in high product mix environments. The four compatible machines (MG-1R, MG-2, MG-3 and MG-8R) place complex components and odd-forms with equal ease. Machine setup and changeovers are fast and easy for maximum productivity.

The 2008 MG-1R and MG-8R models incorporate reliability and ease of maintenance improvements

Overview & Benefits

outstanding accuracy for high-mix production

The M-Series platform comprises four models (MG-1R, MG-2, MG-3 and MG-8R). Offering outstanding accuracy for high-mix production requirements, they can place a wide range of components including chips, complex and odd-form components. The M-Series offers placement rates up to 105k components per hour with high product quality and low maintenance. The M-Series comes as standard with software and hardware features to improve product quality, increase production efficiency and reduces machine maintenance, including:

- Z-Servo controlled placement heads for accurate stress-free component mounting
- Automatic board width and thickness adjustment for fast changeover
- Automatic nozzle cleaning station
- Automatic temperature feedback compensates for temperature variations
- Fiducial recovery function that eliminates the need to remove and clean the PCB
- Feeder indicators that simplify feeder setup
- Double board support system to decrease board transfer time

You can seamlessly integrate the machines into your factory automation infrastructure, and scale their performance to meet your precise manufacturing needs.

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MG-8R new!
Highly flexible for your most demanding applications

The new MG-8R delivers high-end per

formance with chips, ICs and odd-form components. Not only does it offer placement rates up to 8.5k components per hour with a placement accuracy of 30 micron for ICs and QFPs, but it also handles an extremely wide component range. Precision force control allows optimal handling of press-fit through-hole connectors with insertion forces up to 40 N.

On flight nozzles change head MG-8R MG-8R

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MG-1R new!
The most versatile in the range

Thanks to a high precision single placement beam that carries eight independent Z-servo controlled heads, the MG-1R provides a perfect balance between chip and IC shooting.

Line with MG-1R + MG-8R + LCS (Large Components Sequencer)

It is available in two versions: one with a flying nozzle change head for when many nozzle changes are needed and high output is important, the other with a super fine head for use with a wider component range including QFPs, connectors and tall components. With placement rates up to 24k components per hour, the MG-1R is fast. Placement accuracy is 30 microns for ICs. It handles a wide range of components from 01005 to large connectors (45 x 100 mm), fine-pitch and components up to 15 mm tall. The MG-1R holds up to 96 tape feeders, including stick and bulk parts.

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MG-2
Versatile chip shooter with high placement rate

The MG-2 features a high-precision dual gantry system carrying four beams, each with six heads. Like the MG-1R, it can be

configured with the flying nozzle change head for when many nozzle changes are needed, or with the

super fine head. It places components from 01005 to CSP, BGA, PLCC and QFP with a maximum size of 14 mm square, and achieves mounting speeds up to 42k components per hour with high accuracy and a very low cost per placement.

MG2

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MG-3
The modular high-speed chip shooter

The MG-3 offers operational flexibility on a small footprint. It features four independent X/Y modules, each equipped with an independent Z-axis servo-driven eight in-line multi-head. It places components from 01005 to PLCC and QFP with a maximum size of 14 mm square and achieves placement rates up to 105k components per hour with high accuracy and a low cost per placement. The MG-3 holds up to 128 tape feeders, including stick and bulk parts

MG3

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General spacifications
Specifications	MG-1R	MG-8R	MG-3	MG-2
Maximum output per hour	24k	8.3k	105k	42k
IPC 9850 output per hour	17.4k	7.3k	83k	31.2k
Placement accuracy at 3 sigma	50 micron for chips,30 micron for QFPs	50 micron for chips,30 micron for QFPs	40 micron for chips	50 micron for chips,75 micron for SOIC
Component range	0.4 x 0.2 mm (01005) to 45 x 100 mm	0.4 x 0.2 mm (01005) to 55 x 55 mm,45 x 100 mm	0.4 x 0.2 mm (01005) to 14 x 14 mm	0.4 x 0.2 mm (01005) to 14 x 14 mm
Maximum component height	15 mm	25 mm	6.5 mm	6.5 mm
Programmable placement force	not applicable	10 to 40 N	not applicable	not applicable
Maximum board size (L x W)	standard:460 x 440 mm optional:570 x 500 mm	standard:460 x 440 mm optional:570 x 500 mm	standard: 330 mm x 250 mm (13" x 9.8")	420 x 330 mm
Minimum board size (L x W)	50 x 50 mm	50 x 50 mm	50 x 50 mm	50 x 50 mm
Board thickness	0.4 to 4 mm	0.4 to 4 mm	0.4 x 3 mm	0.4 to 4 mm
Automatic tool bit exchange	nozzles and/or grippers	nozzles and/or grippers	nozzles	nozzles
Tape feeding positions (8 mm)	160 twin tapes, 96 single tapes	160 twin tapes,90 single tapes	128 single tapes	96 single tapes
Feeder options	tape, bulk, stick, manual tray, strips, re-use, tube, waffle pack	tape, bulk, stick, manual tray, strips, re-use, tube,waffle pack	tape, bulk, stick	tape, bulk, stick
Footprint (L x W) incl. front side feeder trolleys	1650 x 1562 mm	1650 x 1562 mm	2380 x 2238 mm	2330 x 1560 mm