Azienda
Home page
Chi Siamo
Dove siamo
News
Prodotti
Pick and Place
Reflow Oven
Vapour Phase
Screen Printer
Solder Wave
AOI - Inspection
Handling
Consumables
Equipments
Promo e Occasioni
Gallery
Photo Gallery
Rappresentanze
Aziende Rappresentate
Contatti
Email
Aggiungi ai Preferiti
Privacy
Policy - Privacy Sito Web
X-Series pick & places
Cost-effective Pick & Place for high-mix, small batches
The X-Series accelerates the route from CAD data to first products. It comprises highly cost-effective, all-in-one solutions for small and medium batch sizes with a high product mix. Well suited to production of large boards and handling of odd-size components, the modular machines are easily configured for an ultra-high feeder count.
Overview & Benefits
The X-Series (Opal-XII, Opal FP-XII, Topaz-XII and Emerald-XII) are complementary and cost-effective Pick & Place platforms for low to medium volume manufacturing at up to 20k components per hour. The machines are easily configured for a high feeder count, and for production of large boards. The machines can be combined to suit specific production requirements. The X-Series provides a perfect balance between outstanding versatility and value for money. The machines use the same feeder platform, operating software and Graphical User Interface as the M-Series. The benefits of the X-Series include:
- Fast and simple machine setup with real-time component inventory check
- Fast production-run changeovers with user-friendly 20-position feeder exchange trolleys
- Easy-to-use and quick to learn
- Easily networked with a centralized component database You can seamlessly integrate the machines into your factory automation infrastructure, and scale their performance to meet your precise manufacturing needs.
- Fast and simple machine setup with real-time component inventory check
- Fast production-run changeovers with user-friendly 20-position feeder exchange trolleys
- Easy-to-use and quick to learn
- Easily networked with a centralized component database You can seamlessly integrate the machines into your factory automation infrastructure, and scale their performance to meet your precise manufacturing needs.
____________________________________________________
Opal-XII
Excel today expand tomorrow
Excel today expand tomorrow
The Opal-XII features a high precision single placement beam carrying four or eight independent Super Fine heads with exchangeable nozzles. It places up to 17.7k components per hour with 40-micron accuracy. It handles components from 01005 to large connectors, fine-pitch QFP, BGA, µBGA and CSP packages, and components up to 15mm tall. The Opal-XII holds up to 100 tape feeders including stick and bulk parts.
The Opal-XII has standard features that improve product quality and manufacturing efficiency including:
- Automatic board width and thickness adjustment for fast changeover
- Automatic temperature feedback compensates for temperature variations
- Fiducial recovery function that eliminates the need to remove and clean PCBs
- Multi-angle side illumination for any component background
- Automatic board width and thickness adjustment for fast changeover
- Automatic temperature feedback compensates for temperature variations
- Fiducial recovery function that eliminates the need to remove and clean PCBs
- Multi-angle side illumination for any component background
Opal X II
________________________________________________
Fine Pitch Heads
___________________________________________________
Topaz-XII
One machine that does it all!
One machine that does it all!
The Topaz-XII provides a perfect balance between chip and IC shooting thanks to its high precision single placement beam with eight independent controlled heads. The Topaz-XII is available in two versions. When many nozzle changes are needed and high output is important, the Flying Nozzle Change (FNC) head is recommended. For handling a wider component range including QFP, connectors and high components, the Super Fine head is ideal.
The high-precision single placement beam carries either four FNC heads (each with three nozzles) and four standard heads or eight Super Fine heads with exchangeable nozzles. The FNC heads exchange nozzles on the fly to increase overall machine efficiency.
With placement rates up to 20k components per hour, the Topaz-XII is fast. Placement accuracy is 35 microns for ICs. It handles components ranging from 01005 to large connectors (45 x 100 mm), fine-pitch and components up to 15 mm tall. The Topaz-XII holds up to 90 tape feeders, including stick and bulk parts.
Topaz XII FNC Head (On Flight Nozzles Change)
_________________________________________________
|
General specifications | ||||
| Item | Opal-XII | Topaz-XII | ||
| Maximum output per hour | 11.6k (4 heads) 17.7k (8 heads) | 20k (Super Fine head or Flying Nozzle Change head) | ||
| IPC 9850 output per hour | 9.6k (4 heads) 13.9k (8 heads) | 15.4k | ||
| Placement accuracy at 3 sigma | 50 micron for chips, 40 micron for QFPs | 50 micron for chips, 35 micron for QFPs | ||
| Component range | 0.4 x 0.2 mm (01005) to 45 x 100 mm | 0.4 x 0.2 mm (01005) to 45 x 100 mm | ||
| Maximum component height | ||||
| Standard | 6.5 mm | 6.5 mm | ||
| Optional | 15 mm with area CCD camera | 15 mm with area CCD camera | ||
| Programmable placement force | not applicable | not applicable | ||
| Maximum board size (L x W) | ||||
| standard | 460 x 440 mm | 460 x 440 mm | ||
| optional | 650 x 850 mm | 650 x 850 mm | ||
| Minimum board size (L x W) | 50 x 50 mm | 50 x 50 mm | ||
| Board thickness | 0.4 to 4 mm | 0.4 to 4 mm | ||
| Automatic tool bit exchange | nozzles and/or grippers | nozzles and/or grippers | ||
| Tape feeding positions (8 mm) | 100 single tapes | 96 single tapes | ||
| Feeder options | tape, bulk, stick, manual tray, strips, re-use, tube, waffle pack | tape, bulk, stick, manual tray, strips, re-use, tube, waffle pack | ||
| Footprint (L x W) incl. front side feeder trolleys | 1650 x 1408 mm | 1650 x 1408 mm | ||
