sistema di ispezione a raggi X modello AX 7100L

AX-7100L

Product  Description

Introduction:

The Unicomp AX7100L is a smaller version of our AX8100. This machine is equally as powerful as the AX8100, but we have economized and scaled down the system motion controls to reduce the cost to our customers. The AX7100L is effective for many applications within the PCB manufacturing process. BGA, CSP, filp chip. COB, QFN, standard SMT and PTH attachment quality.

As a flexible workstation, the AX7100L is a powerful support tool for process development, process monitoring and refinement of the rework operation.

In addition to the PCBA analysis, the AX7100L can be utilized for many other electronics applications within a typical PCBA factory.

The AX-7100L is excellent for: 

  • Incoming inspection of semiconductors
  • Multi-layer PCB quality monitoring
  • Encapsulated assemblies and components

 

 

 

 

Unicomp AX-7100L  X-ray Machine Benefits: 

  • Performance/Price
  • Small footprint/Mobile
  • Ergonomic design
  • Hi-tech appearance
  • Large sample area
  • Large field of view (FOV)
  • High resolution dual fielddetector

 

  • Variable magnification
  • Angle viewing
  • Powerful software work-station
  • Intuitive opetartor interface
  • SPC data collection
  • Maintenance friendly - Easy acces
  • Plug and play set-up

 

 Machine Operation

 

 

QFN internal and external solder attachment 

QFP Lead attachment and lifted leads

 

PLCC tilt view solder attachment

 

Semiconductor bond wire attachment

 BGA open and lack solder

 

BGA cold solder connection

Fine Pitch BGA soldering defects

 

CSP tily viewv voids and lack of solder

 

BGA tilt view of voids and wirte bonds 

 

BGA tilt view open and lack sof solder

 UXI Image processing Workstation

CSP live X-ray image

BGA area/diameter analysis result

Multi-Chip Mudule live X-ray image

Multi-Chip Module image 3D enhanced

BGA angle view live X_ray image

BGA angle view image 3D enhanced

BGA voids live X-ray image

BGA voids calculation with full report

X Ray process...."Image is everything"

Specifications:

 

Machine Dimensions(W×D×H) 850×1000×1590mm
Weight 580Kg
Operating Temperature Temperature: 0℃-40℃
Humidity: 30-70RH
Line Voltage 100-230VAC,50/60Hz
Power Consumption 0.5KW(max)
Magnification 250X
Maximum PCB Size 450×400mm
Maximum Inspection Area 420×400mm
Tilt ±70°Tilt
Rotation 360°(option)
X-Ray Tube X-Ray Tube Type Sealed Tube
X-Ray Tube Voltage 100kV
X-Ray tube Current 0.25mA
X-Ray Tube Focal Spot Size 5μm
Detector Image Detector High Resolution Dual Mode Image Intensifier with FOV(4"/2")
Detector Resolution 75/110Lp/cm
Software Image Processing Software AX-UXI
Modbus Interface Not available
Applications BGA High
CSP High
QFN High
QFP High
PLCC High
COB High
Chip Component High
Power Transistor High
Connector High
Plated Thru Hole High
Multi Layer Board High
Safety X-Ray Emission <1μSv/hr

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