Macchina di isppezione a raggi X  AX 8100

 AX-8100


Product Description :

Introduction:

The Unicomp AX8100 machine is designed to provide high resolution X-ray imaging for the electronics industry. Our system is effective for many applications within PCB manufacturing process. BGA, CSP, filp chip, COB, QFN, standard SMT and PTH attachment quality can be analyzed using the AX8100.
As a flexible workstation, the AX8100 is a powerful support tool for process development, process monitoring and refinement of the rework operation.
In addition to the PCBA analysis, the AX8100 can be utilized for many other electronics applications within a typical PCBA factory.

 

The AX-8100 is excellent for:

  • Incoming inspection of semiconductors
  • Multi-layer PCB quality monitoring
  • Encapsulated assemblies and components

 

 

 

Unicomp AX-8100 X-ray Machine Benefits:

 

  • Performance/Price
  • Small footprint/Mobile
  • Ergonomic design
  • Hi-tech appearance
  • Large sample area
  • Large field of view (FOV)
  • High resolution dual fielddetector
  • Variable magnification
  • Angle viewing
  • Powerful software work-station
  • Intuitive opetartor interface
  • SPC data collection
  • Maintenance friendly-Easy acces
  • Plug and play set-up
  • Modbus interface
  • Step and repeat programming

Machine Operation

 

 

Modbus Interface:
Modbus is an optional interface for the AX-8100 x-ray system.
This is a highly advanced software and hardware package that provides ultimate
flexibility in the machine operation. Semi-automated and fully automated operations
can be performed with Modbus.

 

 

 Key Software Features:
•Motion controls X/Y/Z
•Power and image contrast settings
•Click and go positioning
•Auto-image set (X/Y/Z location, FOV and kv)

 

Step end repeat programming interface

Component reference imege for clear position correction

Pre-programming of X/Y/Z motion speeds

Reference window for all key image setting

Data transfer to SPC spreadsheet for process monitoring

Real time histogram of all image grey scale value

 

UXI Image processing Workstation

 

CSP live X-ray image

BGA area/diameter analysis result

Multi-Chip Mudule live X-ray image

Multi-Chip Module image 3D enhanced

BGA angle view live X_ray image

BGA angle view image 3D enhanced

BGA voids live X-ray image

BGA voids calculation with full report

X Ray process...."Image is everything"

 

Specifications:

Machine Dimensions(W×D×H) 1080×1180×1730mm
Weight 800Kg
Operating Temperature Temperature: 0℃-40℃
Humidity: 30-70RH
Line Voltage 100-230VAC,50/60Hz
Power Consumption 0.5KW(max)
Magnification 250-750X
Maximum PCB Size 500×500mm
Maximum Inspection Area 450×450mm
Tilt ±70°Tilt
Rotation 360°(option)
X-Ray Tube X-Ray Tube Type Sealed Tube
X-Ray Tube Voltage 100kV
X-Ray tube Current 0.25mA
X-Ray Tube Focal Spot Size 5μm
Detector Image Detector High Resolution Dual Mode Image Intensifier with FOV(4"/2")
Detector Resolution 75/110Lp/cm
Software Image Processing Software AX-UXI
Modbus Interface Option
Applications BGA High
CSP High
QFN High
QFP High
PLCC High
COB High
Chip Component High
Power Transistor High
Connector High
Plated Thru Hole High
Multi Layer Board High
Safety X-Ray Emission <1μSv/hr

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